By Month (April 2016)


After Long Wait 3rd Gen FLIR Finally Moves Ahead PREMIUM

After numerous delays over a period of ten years, the U.S. Army has finally put 3rd Gen FLIR onto a path where it will become reality. Awards have been made for the Engineering and Manufacturing Development (EMD) for the 3rd Gen B-kit which will be used to upgrade 2nd Gen B-kits in a number of vehicle sighting systems and in targeting systems. The 3rd Gen B-kit consists of a Dewar Cooler Bench (DCB), afocal imager and circuit card assemblies.

Teledyne Dalsa Launching Uncooled Camera CorePREMIUM

Teledyne Dalsa (Waterloo, Canada) is releasing a new uncooled camera, Calibir, based on a Ulis 640 x 480 amorphous silicon microbolometer with 17 micron pixels.

Finmeccanica Lets Leonardo Take WingPREMIUM

5N Achieves Improved InSb Crystal GrowthPREMIUM

5N Plus Semiconductors (St. George, Utah) has developed an improved method of growing InSb boules that enables the efficient production of high quality InSb wafers and holds out the promise for higher yield InSb FPAs at lower cost.

TriWave SWIR Technology DiscontinuedPREMIUM

A Preview of Cryogenic Coolers for Infrared Detectors at SPIEPREMIUM

New Infrared Imaging ProductsPREMIUM

Government Contract AwardsPREMIUM

Government Contract SolicitationsPREMIUM

Late-Breaking Government Contract SolicitationsPREMIUM


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