Based on new high dynamic range 12 µm core
What the Presentations Did Not Say
NASA’s NEO Surveillance Mission
Fills Customer Pipeline
In an effort to stay out of highly competitive commercial markets some microbolometer suppliers are staying out of the mid-format (320 x 240) small pixel (10-12 µm) market.
Defense Segment Will Continue Work on Night Vision
Synergies in Infrared
Spectral Images for Operational Use
Launches FastFPA Program
SDD Contract Sets the Stage for Production of 3rd Gen FLIR Engines
The Alternative Infrared Satellite System (AIRSS) program has become a follow-on to SBIRS High
The U.S. Army’s effort to develop and field a 3rd Gen FLIR is moving into the System Development and Demonstration (SDD) phase.
Teledyne Scientific & Imaging, LLC has entered into an agreement to acquire Judson Technologies, LLC.
The size of infrared focal plane arrays (FPA) is poised for a large increase. Currently, both InSb and MWIR MCT arrays have been fabricated in a 2K x 2K monolithic configuration, with the InSb FPA used in the SHARP reconnaissance pod and the MCT FPA used in the NIRCam instrument on the James Webb Space Telescope (JWST).
Research on Type II Superlattice (T2SL) FPAs is increasing rapidly as evidenced by the ten papers presented on these detectors at the April SPIE Infrared Technology & Applications Conference in Orlando. Currently, most of this work is aimed at improving performance in the LWIR, since good performance has already been demonstrated in the MWIR.
3rd Gen infrared technology has moved out of R&D with the completion of the U.S. Army’s Dual-Band FPA Manufacturing Program (DBFM). The technology is being transitioned from an Advanced Technology Objective (ATO) to Systems Development and Demonstration (SDD) in which complete 3rd Gen FLIR engines (B-kits) will be developed over the next 2 - 3 years.
The U.S. Air Force is hedging its bets on the long-delayed Space Based Infrared System High and starting an alternative program that injects the most recent advances in infrared focal plane array technology.
Teledyne Technologies, Inc. has entered into an agreement to acquire Rockwell Scientific Co., RSC, Los Angeles, California) for $167.5 million in cash from Rockwell Collins and Rockwell Automation.