Secures On-going Financing
A Setback for a Novel Uncooled Sensor
Plans Production Rollout in 2009
More than a dozen companies are pursuing novel uncooled technologies in an effort to compete with the predominant uncooled VOx and amorphous silicon microbolometer technologies. Recently, two companies have demonstrated progress in narrowing the gap with the incumbent uncooled technologies.
Uncooled infrared focal plane arrays based on vanadium oxide and amorphous silicon microbolometers are now well established. But new technologies are around the corner.
RedShift Systems is readying its uncooled Thermal Light Valve™ (TLV) camera cores for additional demonstrations to customers.
RedShift Systems has landed $12 million in first round venture capital financing. The round was led by InterWest Partners and also included strong participation from existing shareholders who sponsored the 2005 spin-off of RedShift from Aegis Semiconductor, Inc.