Raytheon Vision Systems (Goleta, California) is in the fortunate position of having the largest portfolio of advanced infrared detectors in the world, including mercury cadmium telluride (MCT), InSb, InGaAs, uncooled VOx microbolometers and others. Recently, the company’s III-V T2SL (Type II Superlattice)/nBn detectors have also reached a level of maturity that enabled Raytheon to win the contract for the next-generation Distributed Aperture System (DAS) for the F-35 Joint Strike Fighter.
The company has been awarded a Rapid Innovation Fund (RIF) award to develop dualband (MWIR/LWIR) T2SL FPAs for potential use in the 3rd Gen FLIR program. Currently, 3rdGen FLIR development is based on 1280 x 720 dualband MCT FPAs.
Copious Imaging (Lexington, Massachusetts), a spin-off of MIT Lincoln Labs, intends to transform infrared Read-out Integrated Circuits (ROICs) by not only placing a small low-power analog-to-digital converter at each pixel to form a DROIC (Digital-pixel ROIC) but also provide each pixel with computational capability to produce "Computational Pixel Imagers."
Moving into Phase II