By Company (HRL Labs)

April 2024

HRL Moving Curved FPAs into CamerasPREMIUM

April 2023

Solicitation for 3rdGen FLIR DCB Production is Opened Up AgainPREMIUM

August 2021

HRL Labs Setting Up New Fab for Production of III-V FPAsPREMIUM

December 2020

HRL Develops Two-Color MWIR/MWIR and MWIR/SWIR III-V FPAsPREMIUM

February 2020

Cyan Systems Developing Infrared Facial Recognition TechnologyPREMIUM

November 2019

DARPA WIRED Program Goes into Final PhasePREMIUM

HOT Wafer-level FPAs fabricated directly on silicon ROICs

June 2017

Advances in T2SL FPAs and the Move into Mainstream Military ProgramsPREMIUM

February 2017

Cyan Systems and HRL Make 2K x 1K HOT nBn FPA with 5 Micron PixelsPREMIUM

November 2016

VISTA Program Comes out of the ClosetPREMIUM

August 2016

DARPA WIRED Program Aims to Move Infrared Detectors to a New LevelPREMIUM

Multi-megapixel infrared imaging at room temperature for wafer-level scalable FPAs at low-cost

April 2015

Raytheon and DRS Partner on 3rd Gen IFLIR B-KitPREMIUM

March 2014

VISTA Phase II Gets UnderwayPREMIUM

June 2010

The Latest on DARPA Infrared ProgramsPREMIUM

April 2010

Progress in T2SL Infrared DetectorsPREMIUM

January 2010

Company BriefsPREMIUM

May 2009

MDA Places Bet on Superlattice Detectors as Potential Replacement for MCTPREMIUM

Launches FastFPA Program