FLIR Systems, which has long concentrated on its mature InSb FPA technology has been internally developing Type 2 Superlattice (T2SL) FPAs for use in future products.The company, which has been part of the VISTA consortium, is making use of the InAs/GaSb epitaxial structures that have been developed by JPL and NRL under the VISTA program and grown by IntelliEPI and IQE. It is expected that the company will soon introduce a camera core based on a HOT MWIR 640 x 512 FPA with 15 micron pixels.
Raytheon and Lockheed Martin have signed a contract under which Raytheon will provide the next-generation EO-DAS (Electro-optical-Distributed Aperture System) for the F-35 Joint Strike Fighter. The new system will make use of very large format, small pixel MWIR nBn FPAs developed by Raytheon Vision Systems (Goleta, California).
A breakthrough in the more widespread use of Type 2 Superlattice (T2SL) FPAs is about to occur. One of the largest infrared applications in the U.S. - the EO-DAS (Electro-optical-Distributed Aperture System) for the Lockheed Martin F-35 Joint Strike Fighter - is being upgraded to T2SL FPAs (from the existing large format InSb FPAs).The Air Force anticipates two potential upgrades.
L3 Technologies is making changes to its uncooled amorphous silicon (a-SI) microbolometer business. The company’s L3 Sensor Technologies (formerly L3 Infrared Products in Garland, Texas) is moving its front-end production of FPAs to TSI Semiconductors (Roseville, California), while vacuum Wafer-Level-Packaging (WLP) is being moved to Mason, Ohio. By the end of the year, the Garland facility is expected to be shut down, with only design engineering remaining in the Dallas, Texas area.