By Month (April 2016)

After Long Wait 3rd Gen FLIR Finally Moves Ahead

After numerous delays over a period of ten years, the U.S. Army has finally put 3rd Gen FLIR onto a path where it will become reality. Awards have been made for the Engineering and Manufacturing Development (EMD) for the 3rd Gen B-kit which will be used to upgrade 2nd Gen B-kits in a number of vehicle sighting systems and in targeting systems. The 3rd Gen B-kit consists of a Dewar Cooler Bench (DCB), afocal imager and circuit card assemblies.

Teledyne Dalsa Launching Uncooled Camera Core

Teledyne Dalsa (Waterloo, Canada) is releasing a new uncooled camera, Calibir, based on a Ulis 640 x 480 amorphous silicon microbolometer with 17 micron pixels.

Finmeccanica Lets Leonardo Take Wing

5N Achieves Improved InSb Crystal Growth

5N Plus Semiconductors (St. George, Utah) has developed an improved method of growing InSb boules that enables the efficient production of high quality InSb wafers and holds out the promise for higher yield InSb FPAs at lower cost.

TriWave SWIR Technology Discontinued

A Preview of Cryogenic Coolers for Infrared Detectors at SPIE

New Infrared Imaging Products

Government Contract Awards

Government Contract Solicitations

Late-Breaking Government Contract Solicitations

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