By Company (Raytheon Vision Systems)


June 2017

November 2016

September 2016

New ASRAAM Missile Seeker Gives Leonardo (Selex ES) FPAs a Boost

UK Builds ASRAAM Inventory for its New F-35 Fighters

May 2016

January 2016

Seek Thermal Rolling Out Mid-Format Uncooled Core

Seek Thermal (Goleta, California) is ready to go into production with a new uncooled core based on Wafer-Level-Packaged (WLP) 320 x 240 VOx microbolometers with 12 micron pixels, a significant upgrade over the company’s existing 206 x 156/12 microbolometers.

November 2015

October 2015

July 2015

May 2015

April 2015

December 2014

November 2014

June 2014

April 2014

March 2014

January 2014

FLIR Launches Double Whammy

Ultra Low-Cost Thermal Core and Smartphone Attachment

December 2013

October 2013

September 2013

DARPA PIXNET Program Gets Underway

Ultra-Small Muti-Band Uncooled Camera

August 2013

June 2013

February 2013

October 2012

July 2012

April 2012

January 2012

Spectrolab Moves InGaAs APDs into Production

An Enabling Technology for 3D Imaging

August 2011

July 2011

DARPA Funding Tiny, Low-Cost Uncooled FPAs and Camera Cores

Pushing Uncooled Infrared Toward a Cell Phone Model

February 2011

ITT to Split into Three Companies

Defense Segment Will Continue Work on Night Vision

June 2010

May 2010

April 2010

February 2010

January 2010

December 2009

November 2009

September 2009

Pushing Uncooled Detector Technology to Its Limits

Smaller Pixels and Larger Formats

August 2009

June 2009

May 2009

April 2009

February 2009

U.S. Army Moves Ahead with 3rd Gen FLIR Award

SDD Contract Sets the Stage for Production of 3rd Gen FLIR Engines

July 2008

Multiple Kill Vehicle Seeker Development Moves to Next Phase

The Multiple Kill Vehicle (MKV) program for developing a robust mid-course ballistic missile interceptor is moving to a prototype seeker that will be able to track multiple targets and then guide multiple kill vehicles to destroy them.

 

April 2008

The Race to 17 Micron Pixels

Manufacturers of uncooled microbolometers are racing to develop and introduce focal plane arrays with 17 micron pixels. The smaller size pixels are seen by producers as a way to differentiate their products and as a path to lower cost and higher volume markets.

January 2008

EO/IR System for DDG 1000 Moves into Production Phase

The EO/IR system for the U.S. Navy’s next-generation DDG 1000 (Zumwalt class) destroyer (including stealth and electric propulsion) is moving into the production phase.The EO/IR system is being developed by a team being led by Raytheon Integrated Defense Systems

May 2007

T2SL Research Intensifies

Research on Type II Superlattice (T2SL) FPAs is increasing rapidly as evidenced by the ten papers presented on these detectors at the April SPIE Infrared Technology & Applications Conference in Orlando. Currently, most of this work is aimed at improving performance in the LWIR, since good performance has already been demonstrated in the MWIR.

January 2007

3rd Gen FLIR Moves Out of Research and Development

3rd Gen infrared technology has moved out of R&D with the completion of the U.S. Army’s Dual-Band FPA Manufacturing Program (DBFM). The technology is being transitioned from an Advanced Technology Objective (ATO) to Systems Development and Demonstration (SDD) in which complete 3rd Gen FLIR engines (B-kits) will be developed over the next 2 - 3 years.

December 2006

Uncooled with 17 µm Pixels

The U.S. Army’s effort to keep pushing the performance of uncooled sensor technology is again bearing fruit. All four contractors developing ultra-small pixel uncooled microbolometers have demonstrated 640 x 480 focal plane arrays with 17 µm pixels in thermal weapon sights.

February 2006

Irvine Sensors in FFW Contract

Irvine Sensors has been awarded a contract by Rockwell Collins Optronics for the miniature thermal imagers for the Future Force Warrior (FFW) head-mounted sensor. The Irvine Sensors cameras are based on the company’s tiny CamNoir which makes use of an IC stacking technique (“Neo-Stack) for producing highly compact electronics packages.

Prelude to TWS III

Although the U.S. Army’s TWS II program using high performance 25 µm pixel uncooled VOx microbolometers (640 x 480 and 320 x 240) is just getting started, the next-generation, with 17 µm pixels is already getting underway. Under a program funded by PEO Soldier and with the technical monitoring of the Night Vision & Electronic Sensors Directorate, four companies have been selected to develop 640 x 480 microbolometers with 17 µm pixels and deliver two Thermal Weapon Sights and two thermal imaging modules.

January 2006

Uncooled B-kit in Phase II

The U.S. Army’s effort to develop standard interchangeable imaging modules based on uncooled VOx microbolometers went into Phase II with the awarding of contracts to BAE Systems Infrared Imaging Systems, DRS Infrared Technologies and Raytheon Vision Systems in September 2005. Under Phase II of the Uncooled B-Kit (UBK) program, the emphasis is on 640 x 480 pixel imaging modules.