By Company (Mitsubishi Electric)


September 2013

September 2012

April 2012

August 2011

May 2011

August 2010

Interest in Infrared Increases in Japan

New Support for Small Pixel Uncooled Microbolometers

January 2010

October 2009

Infrared in Japan

The Latest Developments

June 2009

January 2009

July 2007

April 2006

Mitsubishi Develops Chip-Scale Vacuum Package for Uncooled SOI Sensor

Mitsubishi Electric has developed a chip-scale vacuum package for its 160 x 120 (25 µm pixels) uncooled SOI FPAs.